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SMT IN-LINE ASSEMBLY:
- Screenprinter, Working area 510 x 510 mm, Vision system
- PCB Loader.
- Dispenser, Working Area 510 x 460 mm, Vision system, adhesive and solder paste,
- Pick & Placer , Working area 510 x 440, Rated speed 21.000 CPH, Component range
0201 and up; SOIC; PLCC; TS(S)OP; QFP, BGA, FLIP CHIP, Surface mount connectors
- Inspection/Asembly workstation, Odd Surface Component placement
- Reflow oven, Working width 30 to 500 mm, 5 process zones with active cooling
- PCB Unloader
SMT BATCH ASSEMBLY:
- Screenprinter, Vision System, Working area 510 x 510 mm.
- Manual SMT workstation
- Manual BGA workstation, Vision alignment system
- Reflow oven, Working width 400 mm.
- Vapor phase soldering system, Working area 500 x 600 mm.
TH ASSEMBLY:
- Preforming axial and radial components
- Insertion Guided Assembly station
- Manual Assembly workstations.
WAVE SOLDERING:
- Inline Double Wave (Lead), Processing Thru-Hole, SMD components.
- Inline Double Wave (Lead-FREE), Processing Thru-hole, SMD components.
- Selective Soldering, (Lead & Lead-Free), Processing Thru-hole, SMD components.
QUALITY INSPECTION:
- Visual Inspection.
- X-RAY Inspection system, Working Area 510 x 510 mm.
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