SEMICONDUCTOR PACKAGING AND ASSEMBLY:

- PLASMA CLEANING, Chamber dimension 457 W x 457 H x 610 D, process gases argon; hydrogen;helium etc.

- BALL SURFACE TESTING.

- PRECISION DISPENSING, Dispense area 350 x 350 mm, Mass flow control, Calibrated process jetting, Jet on the fly,
   Dynamic dispense Control.

- DIE BONDER, Working area 305 x 180 mm, Flip Chip, MCM/Hybrid/COB, Silver Glass, Eutectic, Ultrasonic processes.

- THIN WIRE BONDER, Working area 313 x 180 mm, Piezo bondheads 45/60 and 89 degrees, Fine pitch better than 40
   micronmeter, Wire diameter 17,5-85 micronmeter, Wires Aluminium, Gold; Copper; Ribbon, Loop geometries 70 - 20.000
   micronmeter.

- ADVANCED WIRE BOND TESTING, Wire pull, Tweezer pull/peel, Ball shear, shear and materials testing.

- PROBE AND FUNCTIONAL TESTING.

- PRODUCT/COMPONENT PACKAGING AND SEALING, Cleanroom class 4 - 7

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